8.Use Endurance 使用耐久性 | ||
Item项目 | Test Condition测试条件 | Requirements要求 |
8.1 Solderability 焊接性 |
Oven Temperature:235℃±5℃,Time: 5S±1S 锡炉温度:235℃±5℃ 时间:5秒±1秒 |
Tin Area:90% 焊接面积90%以上 |
8.2 patience high temperature 焊接耐热性 |
Preheat: Temperature on the copper foil surface should reach 180℃, 2±0.3 minutes after The P.W.B entered into the soldering equipment 预热:在P.W.B(印刷线路板)进入焊接设备后, 2±0.3分钟内铜箔表面要达到180℃ Soldering heat: Temperature on the copper foil surface should reach the peak temperature of 260℃ within 5 seconds after the P.B.W entered into soldering heat zone. 焊接温度: 在P.W.B(印刷线路板)进入焊接温区5秒内, 铜箔表面达到峰值温度260℃ |
表面无起泡,变型 Surface of plastics don’t frothed And formed |